Discover: die-to-wafer hybrid bonding | CEA-Leti
VloĆŸit
- Äas pĆidĂĄn 21. 08. 2023
- Discover CEA-Leti expertise in terms of hybrid bonding: the different stages of die-to-wafer process in CEA-Leti clean room, starting with Chemical Mechanical Planarization (CMP), through die-to-wafer bonding, alignment measurement, characterization of bonding quality and grinding.
#HybridBonding #3D #packaging
Thank you for watching! Whether you are a company looking for a technological advantage for your product or a student, recent graduate, or technology professional looking for your next exciting career opportunity, check out the links below!
------
đ Before you go, subscribe to our channel: bit.ly/suscribe-CEALeti
â© Follow us on LinkedIn: Leti - / leti
â© Follow us on X: @CEA_Leti - cea_leti?lang=fr
â© CEA-Leti breakthroughs and more on our website: www.leti-cea.com/cea-tech/leti...
â© Relive Leti Innovation Days: www.leti-innovation-days.com/
đ Learn more about CEA-Leti in this short video: bit.ly/CEALeti - VÄda a technologie
éćžžæŒäșźçć¶çšć±ç€șïŒè°ąè°ąă
This impressivley show the spirit and creativity of the semiconductor industry.
What can you say about durability, long lifespan of Power Management IC units in chiplets
What we will see in 2027 in term of implementation 2nm chiplet packaging in consumer gadgets.
u'll im problem plz complete!
Very cool!