Advanced Electronics Packaging - Cu Bonding Technology: Use Cases and Prospects

In this iNEMI technical sharing session, Dr.Chuan Seng Tan of Nanyang Technological University (Singapore) talks about direct Cu bonding, which offers benefits such as better scalability, performance and reliability for ultra-fine pitch connections below 10 µm. Dr. Tan presented an historical perspective, the current state of development and he highlighted use cases and reviewed recent progress in Cu hybrid bonding.
Download presentation: thor.inemi.org/webdownload/202...