Packaging Part 8 - Failure Analysis for IC Packaging

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  • čas přidán 2. 08. 2024

Komentáře • 7

  • @joannayuan6869
    @joannayuan6869 Před rokem +2

    As an investor at a Semiconductor company, I hear the 3 letter acronym thrown around every other sentence. Over time, I got a rough idea what some of those are. This video series really helped me put all things together. Amazing work.

  • @raymondjiang7398
    @raymondjiang7398 Před 2 lety +4

    Thanks for this amazing presentation series! Concise and clear!

  • @vince9072
    @vince9072 Před 3 lety +1

    Love ur stuff. Possible to deep dive to testing side of things? Testing equipment such as system level, burn-in, etc.

  • @Redduck
    @Redduck Před 2 lety

    Very good presentation !

  • @AndrewSteffenHB
    @AndrewSteffenHB Před rokem

    Thank You

  • @yummyaa
    @yummyaa Před 2 lety

    Good information 👍

  • @jieliu597
    @jieliu597 Před 2 lety

    macam mana nak buat?