I think that's the most common method. I works even better on multi layer boards (4+ layers). You just need to watch out what the "hot" layer is - for example if its the switching node of an SMPS or something noisy or sensitive making its area to large might cause problems.
Thanks you so much. Just now I have prepared a foot print using the via heat transfer method, which is more than enough for my application. Here after I'll consider all those method which you mentioned in the video.
For method with vias hole. How to avoid protrusion during soldering process? PCBway mention cannot do the vias underneath component due to protrusion during soldering process. I also try the vias fill in with resin. But not really prefer that way due the price is very expensive.
how can we calculate copper area on pcb for heat transfer.. or this video shows heat sink for heat transfer if we can use copper pad (open masking) then how to calculate PAD size ..
Hi. Thank you for all your job ! If you have some time one day and if it interests you, I would be interested in how to select an heatsink. They are many parameters to take into account for doing a good design. Base surface, fins, kind of fins, space between fins without talking about materials, etc. There is a good article on wikipedia about heatsink but I did not get the time to do the experiments.
In my design, can I use a thermal polygon for ac main 230V? I mean, Should I? Should the trace width/polygon be as long as possible or as minimum as possible? I was thinking the longer and wider the trace, will help in heat sinking. Thanks in Advance. Really liked the video
And forgive me if I'm wrong, but connecting the pad to the copper directly all over the board like board #3 means the 2A is flowing all across the board, Right? Is that fine?
Well, as long as all necessary precautions are taken (for example sufficient distance to other traces) it should not matter if you have a polygon for mains. In the end, the board in a device should not be accessible. Anyway, having polygons or not will not influence the basic circuit - there will still be protection elements like fuses. Regrading your second point, why would that be a problem? The more and thicker the copper, the lower its resistance is and less self heating occurs. Its quite common in designs to have a "ground plane" that goes all over the board and which has every return current, so you can get quite large peaks.
@@FesZElectronics Oh. Yeah I get what you're saying. And yes the circuit won't be directly accesible to human touch. It will be encased. And because of that and also trying to shrink the size, I was worrying about improving the thermal design. I'm planning on keep a mains polygon on both sides and then using thermal vias like you showed. I was also worried that larger the trace/polygon would increase unwanted capacitance and since voltage is 220vac I was wondering what to do.
Grate comparison, sadly metal cores are available with only 2 layers, from most manufacturers. What did you use to cote the bods with ? did it made a big difference on the images ?
Hello @Max B ! I just took some random white paint I had around; its not the right time to go out shopping... To be honest it did make a bit of a difference, and I will cover this in the next video (next week)
Well, if you end up leaving the copper without any solder mask - the reason why you have the solder-mask in the first place re-appears; its there to protect the copper from corrosion and to insulate it electrically. I think that not putting any solder mask will have a minimal thermal influence - its not that good as a thermal insulator because its so thin, but it will cause major reliability issues, so having it is the lesser evil.
Well one of the big issues with this experiment was that the copper thickness was not exactly the same on all boards. I mean they where all 35um on paper, but in practice the thickness was variable. That had quite a big impact on measurement reliability...
Thanks for this great video. I usually use the vias method over two layers
I think that's the most common method. I works even better on multi layer boards (4+ layers). You just need to watch out what the "hot" layer is - for example if its the switching node of an SMPS or something noisy or sensitive making its area to large might cause problems.
Im dealing with some overheating on a design so I came straight to your channel and voila! You never fail to deliver. Great work
I am trying to reduce the heat of a LED PCB and this was exactly what I was looking for. Thank you for the great work here!
I like that you took care of the emissivity. good job.
Awesome explanation!
Thanks you so much. Just now I have prepared a foot print using the via heat transfer method, which is more than enough for my application. Here after I'll consider all those method which you mentioned in the video.
Hi, thank you for this great video. 👍 Can I use some frames from this video for my new video?
Very nice tutorial, thanks!
Glad you enjoyed it!
Bro... You are the best. Congratulations!! And thanks...!!
I'm happy you enjoyed it! Thank you too!
Thanks to share thoses informations !
Awesome explanation. Many thanks
Nice information
Thanks, it helped a lot my project
Can you do a video on how to design a SMD led board for lightning? Maybe a Quantum Board with an aluminum layer for better dissipation.
great video easy to watch thanks a lot
For method with vias hole. How to avoid protrusion during soldering process? PCBway mention cannot do the vias underneath component due to protrusion during soldering process. I also try the vias fill in with resin. But not really prefer that way due the price is very expensive.
how can we calculate copper area on pcb for heat transfer.. or this video shows heat sink for heat transfer if we can use copper pad (open masking) then how to calculate PAD size ..
Hai pls make a video on diffusion angle (heat spreading angle) and it's impact on thermal resistance of PCB / Gap filler.
Hi. Thank you for all your job ! If you have some time one day and if it interests you, I would be interested in how to select an heatsink. They are many parameters to take into account for doing a good design. Base surface, fins, kind of fins, space between fins without talking about materials, etc. There is a good article on wikipedia about heatsink but I did not get the time to do the experiments.
thank sir
In my design, can I use a thermal polygon for ac main 230V? I mean, Should I?
Should the trace width/polygon be as long as possible or as minimum as possible? I was thinking the longer and wider the trace, will help in heat sinking. Thanks in Advance. Really liked the video
And forgive me if I'm wrong, but connecting the pad to the copper directly all over the board like board #3 means the 2A is flowing all across the board, Right? Is that fine?
Well, as long as all necessary precautions are taken (for example sufficient distance to other traces) it should not matter if you have a polygon for mains. In the end, the board in a device should not be accessible. Anyway, having polygons or not will not influence the basic circuit - there will still be protection elements like fuses.
Regrading your second point, why would that be a problem? The more and thicker the copper, the lower its resistance is and less self heating occurs. Its quite common in designs to have a "ground plane" that goes all over the board and which has every return current, so you can get quite large peaks.
@@FesZElectronics Oh. Yeah I get what you're saying. And yes the circuit won't be directly accesible to human touch. It will be encased. And because of that and also trying to shrink the size, I was worrying about improving the thermal design. I'm planning on keep a mains polygon on both sides and then using thermal vias like you showed. I was also worried that larger the trace/polygon would increase unwanted capacitance and since voltage is 220vac I was wondering what to do.
This is what CZcams made for
thank you very good video
Grate comparison, sadly metal cores are available with only 2 layers, from most manufacturers. What did you use to cote the bods with ? did it made a big difference on the images ?
Hello @Max B ! I just took some random white paint I had around; its not the right time to go out shopping... To be honest it did make a bit of a difference, and I will cover this in the next video (next week)
Great sir, tq.
As I know the solder mask has a bad influence on the thermal performance as well. Is it worth to cut out that layer around the component in question?
Well, if you end up leaving the copper without any solder mask - the reason why you have the solder-mask in the first place re-appears; its there to protect the copper from corrosion and to insulate it electrically. I think that not putting any solder mask will have a minimal thermal influence - its not that good as a thermal insulator because its so thin, but it will cause major reliability issues, so having it is the lesser evil.
Hi man, greats videos!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!
Glad you like them! Thank you!
Great experiment! But temp with thermal relief: 76,4 C and without: 78,2 C... hmm
Well one of the big issues with this experiment was that the copper thickness was not exactly the same on all boards. I mean they where all 35um on paper, but in practice the thickness was variable. That had quite a big impact on measurement reliability...
Boop