Cold Plate: Made Better with Additive Manufacturing

Intro: 0:00
Cold Plate Workflow: 0:49
Generate Multiple Iterations: 2:46
Mesh and Simulation: 3:05
Why would you want to do this?: 3:15
When cooling IGBT modules and high-powered semiconductors, air cooling is often inadequate, so liquid cooling is required. Cold plates are devices that transfer heat from the hot surfaces of power electronics to the fluid of the liquid cooling system. The performance of these components is critical to the overall effectiveness of the system.
In this nTop Live, Yuki Okada, Technical Marketing Engineer, shows you how to design a fully customizable cold plate in nTopology with the same form factor as a traditional alternative that is optimized for Additive Manufacturing.
He first creates a plate with cooling channels that is manufacturable in one piece and then adds a lattice infill that improves heat transfer efficiency, reduces pressure drop, and improves manufacturability. Lastly, he condenses the entire workflow into a reusable block to quickly go through multiple design iterations of the heat exchanger.
Watch and learn how to:
- Create a customizable additively manufactured cold plate design
- Add lattice structures in the fluid domain to improve heat transfer efficiency
- Package the entire process into a reusable workflow to iterate and optimize your design
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nTopology was founded in 2015 to enable engineers and designers to create any geometry - no matter how complex - and to meet the requirements of high-performance products.
Our software is used from research through production to create breakthrough processes and products for the aerospace, automotive, medical, and consumer industries.
Customers depend on nTopology’s generative design capabilities to take full advantage of new hardware, optimize parts where performance is critical, overcome design bottlenecks, and augment their traditional CAD, simulation, and engineering software stack.

[@Bramon83]

3:35 what specifically is that? i need more of that.

[@vladislavshepel6389]

The highly efficient heat exchanger have to have parallel structer. In your sketch paralleled canals have to be placed under each IGBT module. Source of these canals coub pe placed like a front shared tube and drain like a back shared tube. It have to be not a serpentine (in your sketch coolant will be hot already after going under the first IGBT).

[@Music-Meditation]

Can you make a detailed video and do it step by step?