Electron Beam Evaporation Explained

This video will help you understand the process of electron beam evaporation and its use in thin film deposition.
If you want to learn more about Korvus and electron beam evaporation register for our next webinar:
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Video Transcript
Electron beam evaporation is a physical vapour deposition technique that uses a beam of high-energy electrons to heat and evaporate a material to create a thin coating on a substrate.
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The process begins by placing the substrate to be coated in a vacuum chamber
Along with a material, known as the evaporant.
A small piece of wire called a “filament” emits electrons as it’s heated up
And these electrons are then accelerated through a voltage towards the evaporant.
The electrons collide with the atoms in the evaporant material, causing it to heat up and evaporate, creating a thin coating on the substrate.
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A very common question is “why should I use e beam over other deposition methods?”
Ultimately, it’s going to come down to
One, the materials you’ll be using depositing
And two, the type of coating you’ll require.
Electron beam evaporation offers a great alternative to sputtering for evaporating high temperature metals
whilst reducing the physical and radiation damage on sensitive substrates.
The beam of electrons can also be very precisely controlled, meaning that you have the ability to create very thin coatings, down to a fraction of a nanometer.
Another common question is whether to use electron beam evaporation or standard thermal evaporation.
The method of heating is slightly different between the two processes - thermal evaporation uses standard resistive heating of an evaporant material by passing a current through it.
Because of this, e beam can heat the material to much higher temperatures due to the practical limits on cable size for standard resistive heating.
And again, you’ll also benefit from using e beam if you require more precise control over the film thickness.
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At Korvus Technology, we’ve created the HEX Series of modular thin film deposition systems.
And the TAU mini e-beam source is one of many customisations you can make to the system.
It’s particularly unique in the e-beam evaporation space, as it allows for co-evaporation of four different metals at once, while majorly reducing the possibility of stray electrons.
If you’re wondering whether an e-beam evaporation system is right for you, feel free to get in touch with us today and we’ll be happy to help.

[@SushilaRaita-es6pv]

Explained is nice but it is very fast explained

[@korvustechnology]

Hi Sushila, this is just our basic intro to electron-beam evaporation. Check out our webinar on the physics of PVD for some more in depth explanations - register.gotowebinar.com/register/6487718266074549334

[@RahulSingh-ry9ht]

What about ceramics if I have to deposit them..??? Not just metals or metal oxides...!

[@korvustechnology]

If you are depositing ceramics, we recommend using RF sputtering not E-Beam evaporation. Check out our other video for that!