When using those lugs try cleaning area well and using solder mask to attach pad in hole, cure mask as to "place" lug and attach tail after. It helps in bringing pad level with board when a chip with multiple contact points are critical. The mask under pad will be mushy as it wont be cured from light so some finesse helps. The hot air on remount will usually cure the mask under pad, and if not, over time the heat from board will do the trick
Yes that's the way that the usage video from REWA shows too. I remember the first time I used one on a CD3215, even trying to get a pad out of the copper sheet was hard enough :) Good good Tim
When using those lugs try cleaning area well and using solder mask to attach pad in hole, cure mask as to "place" lug and attach tail after. It helps in bringing pad level with board when a chip with multiple contact points are critical. The mask under pad will be mushy as it wont be cured from light so some finesse helps. The hot air on remount will usually cure the mask under pad, and if not, over time the heat from board will do the trick
Yes that's the way that the usage video from REWA shows too. I remember the first time I used one on a CD3215, even trying to get a pad out of the copper sheet was hard enough :) Good good Tim
I love the JS02 tip that you are using there too Tim, but if you tried a Hakko micro pencil FM-2032 I reckon that you would love it.
I have one, cannot get it to work, not sure if my temp is set too high or what. Mine is set up with the T30KN tip.