HBM3 In The Data Center

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  • čas přidán 25. 05. 2024
  • The forthcoming HBM3 standard, why this is so essential for AI chips and where the bottlenecks are today, what kinds of challenges are involved in working with this memory, and what impact chiplets and near-memory compute will have on HBM and bandwidth. With Frank Ferro, senior director of product management at Rambus.
  • Věda a technologie

Komentáře • 1

  • @ChaseCares
    @ChaseCares Před 6 měsíci

    Super interesting and informative video, thanks!