2023 ERI Summit: 3D IC EDA: What is Needed, and How/When Can We Deliver? (Kim)

Sdílet
Vložit
  • čas přidán 18. 09. 2023
  • Dr. WooPoung Kim, Corporate EVP and Head of Packaging Solutions Center of Samsung USA, presents "Low-Cost & Design-flexible 3D-IC Packaging Solutions."
  • Věda a technologie

Komentáře • 1