Features and Benefits of the DFC-H5 Panel Saw & Dust Free Substrate Cutter Combination Machine

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  • čas přidán 23. 07. 2023
  • The DFC-H5 Panel Saw & Substrate Cutter Combination features an easily interchangeable vertical panel saw and a dust free vertical substrate cutter. A 64" Maximum cutting height allows for cutting substrates with the dust free substrate cutter of the machine while using the panel saw capabilities for breaking down thicker substrates. This video walks through the DFC-H5 machine. The maximum cut depth on this machine is 1.75" while the cut accuracy is within 1/32" straight and square.
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