Arizona and the future of semiconductor innovation: Arizona State University (ASU)

America’s most innovative university chips in to advance packaging. ASU has launched a ground-breaking collaboration with Deca Technologies, a Tempe, Arizona-based provider of advanced packaging technology. ASU and Deca will create North America’s first fan-out wafer-level packaging research and development center.
0:00 Introduction
0:14 Moore's Law
1:08 Opportunity knocks
2:33 Our strategy
3:55 The road ahead
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[@pennyagua7324]

Really cool stuff. UofA grad here but so happy ASU is pushing this area of science forward. Arizona will become one of the most important tech hubs in the world if we continue investing in our semiconductor capabilities.

[@revotor8142]

I'm really looking forward to being a part of this incredible field