The packaging play: The future of semiconductor innovation : Arizona State University (ASU)

Arizona State University is at forefront of advanced packaging, the breakthrough microchip technology that combines multiple chips onto a single wafer to make them work faster with powerfully advanced capabilities. A new Center for Advanced Wafer-Level Packaging Applications and Development, created in collaboration with Deca Technologies, will expand domestic semiconductor manufacturing and drive advancements in artificial intelligence, machine learning, automotive electronics and high-performance computing.
0:00 Introduction
0:14 Moore's Law
1:20 Advanced packaging
3:20 Opportunity knocks
4:55 Our strategy
7:24 Just getting started
8:18 The road ahead
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[@AdvantestInc]

As fan-out wafer-level packaging becomes more prevalent, what are the key challenges and opportunities you foresee in scaling this technology for mass production?

[@chadmusch6532]

Go ASU! Killing it! This video is awesome

[@seanjorgenson7251]

What about atomera