First solder-paste dispensing test with my homemade pick and place machine and paste dispenser named 'PP4'. More details on my website: www.vbesmens.de
Great project. My suggestion is Solder paste dispensing is best done with a stencil and squeegee. You can control the height of the paste, aperture, profile and the amount dispensed accurately this way. With your milling skills I am sure you can easily fabricate a stencil holder for the paste application. The stencil can be polymer film type or you can etch your solder pattern on a pre-sensitized 0.5 mm Copper or Brass foil attached to a frame, this process is very similar to PCB etching. Depending on you environment especially humidity the paste can dry up and cause issues with solderability, so immediately after paste application the SMT placement can begin. You SMT placement is at a decent rate for prototyping board applications.Your SMT PCB Placement rate and quality will significantly increase using the suggested method. Maybe you should look into BGA and QFN placement by improving the Step and Repeatabilty of the PnP functions. Just my two cents having worked in developing high density SMT PCB assembly manufacturing solutions in 80's and 90's.
Looks like a pretty neat project! Though if you got this much cnc skill you should really focus on making a cheap stencil laser cutter. Nothing beats a squeegee application of paste that can do 1000s of pads in a couple seconds.
Great project. My suggestion is Solder paste dispensing is best done with a stencil and squeegee. You can control the height of the paste, aperture, profile and the amount dispensed accurately this way. With your milling skills I am sure you can easily fabricate a stencil holder for the paste application. The stencil can be polymer film type or you can etch your solder pattern on a pre-sensitized 0.5 mm Copper or Brass foil attached to a frame, this process is very similar to PCB etching. Depending on you environment especially humidity the paste can dry up and cause issues with solderability, so immediately after paste application the SMT placement can begin. You SMT placement is at a decent rate for prototyping board applications.Your SMT PCB Placement rate and quality will significantly increase using the suggested method.
Maybe you should look into BGA and QFN placement by improving the Step and Repeatabilty of the PnP functions.
Just my two cents having worked in developing high density SMT PCB assembly manufacturing solutions in 80's and 90's.
Looks like a pretty neat project! Though if you got this much cnc skill you should really focus on making a cheap stencil laser cutter. Nothing beats a squeegee application of paste that can do 1000s of pads in a couple seconds.
Are you testing cooling soldering past?
Fantastic project !
COuld you kindly tell me, what is the solder paste brand and wiscosity that you using ?
Regards
i am folowing your project, I think it is awesome!
Hello
If he/it pleases you how to construct this machine
Neat and nice.
Very nice project but as a homemade project maybe need to live inside an electromechanic industry or to a university.