What is BGA Package? | PCB Knowledge

BGA is short for Ball Grid Array. It changes the original J-leads on a dual in-line package or gull-wing leads on the flat package to solder balls, which are arranged in a grid like pattern on the undersurface of the package to increase the area used for the connections rather than just the periphery. In this way, the lead spacing can be evacuated and the number of leads can be increased.
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[@Nchongwei1singapore]

thank you for BGA package expert!

[@electronicstv5884]

Nice video as always👍

[@masteryoda394]

Excellent video.

[@PCBWay]

thanks for your encouragement!

[@BullProspecting]

What is the Mold resin made of?
Thank you for making this video!🙏🏆

[@PCBWay]

DIP package mold resin is typically made of a thermosetting polymer, such as epoxy or silicone.

[@theftking]

Interesting and good info, but the presentation is bizarre.

[@tylernervig9614]

Different culture buddy.

[@LasLexus]

Ok, BGA is compact, but why not LGA?=) It's too small and less chance to heat-damaging of a crystall, especially when it needs to repair
eball!

[@mauricio2915]

What is CGA Package?

[@PCBWay]

CGA stands for Column Grid Array. It is a type of integrated circuit (IC) package that uses solder columns to connect the IC to the printed circuit board (PCB).