I'm designing components for high volume manufacturing (>100,000 pcs/y), so we have to rely on process capability for quality assurance. What are your thoughts on the use of MMC/MMB or envelope, in combination with process capability? Is it feasible or not?
So it means, I will add bonus tolerance to position tolerance(0.05 mm) , after datum B and and C size measuring. For example if datum B size is 25 mm I will add 0.05 mm. If datum C size is 30 mm, I will add 0.1 mm. I measure feature itself as 10 mm, I will add 0.1 mm. In final condition it has 0.05 + 0.05 + 0.1 + 0.1 = 0.3 mm position tolerance. Is it correct?
I'm designing components for high volume manufacturing (>100,000 pcs/y), so we have to rely on process capability for quality assurance. What are your thoughts on the use of MMC/MMB or envelope, in combination with process capability? Is it feasible or not?
So it means, I will add bonus tolerance to position tolerance(0.05 mm) , after datum B and and C size measuring. For example if datum B size is 25 mm I will add 0.05 mm. If datum C size is 30 mm, I will add 0.1 mm. I measure feature itself as 10 mm, I will add 0.1 mm. In final condition it has 0.05 + 0.05 + 0.1 + 0.1 = 0.3 mm position tolerance. Is it correct?
May be datums B and C are equal: A | (B-C) MMC