Reflow of Chip Component

This is a chip component going through the reflow process and leaving solder balls behind. Many times IPC-A-610 CIS students new to the electronics assembly process ask about solder balls. This reflow video just depicts one of the many "why?" ways solder balls can form. solder.net

[@soundspark]

I this case the reason the solder balls form is because the paste flows underneath the chip and when the solder melts it squeezes out bits of molten solder from underneath.

[@jadyaacoub]

at the beginning I thought it's going to be a short circuit

[@Capitan_Papen1918]

What's the name of this component?

[@pbj315]

capacitor