SMD se Hit Maarne Se BGA Chip Kyu Kharab Hota Hai?|| Laptop Chip Level Training || Compufact Systems

Surface Mount Technology (SMT) machines are used for mounting electronic components on printed circuit boards (PCBs). There are two main types of SMT machines: SMD (Surface Mount Device) machines and BGA (Ball Grid Array) machines.
SMD machines are designed to mount components that have leads or pins on their bottom side. These components are usually rectangular or cylindrical and are placed on the PCB using pick-and-place machines. The SMD machines then use reflow soldering to melt the solder paste and attach the components to the PCB.
BGA machines, on the other hand, are designed to mount components that have a grid of tiny balls on their bottom side. These components are usually chips, such as microprocessors and memory modules, that require a large number of connections to the PCB. The BGA machine uses a process called "ball attach" to place the component on the PCB and then uses reflow soldering to melt the solder and attach the balls to the PCB.
In summary, the main difference between SMD and BGA machines is the type of components they are designed to mount. SMD machines are used for components with leads or pins, while BGA machines are used for components with a grid of balls on their bottom side.

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