Introducing Laird Tgel 600

Offering best-in-class thermal performance, the new Laird™ brand Tgel™ 600 dispensable gap filler solution has a minimum bondline thickness of ~20µm and can fill gaps up to 2mm. It is an ideal liquid gap solution in any application that requires effective and reliable heat transfer, including data centers, IGBTs, consumer electronics, telecom systems and more.