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The Sn42Bi58 alloy is the most commonly used, because of the low melt temperature of around 138°C. You can use anything that has a similar melt temperature; anything under 150°C would probably work, so that might rule out the use of anything with silver in it. We do not recommend that heat pipes be relied upon for structural strength, and that includes the joints. If there is expected to be any kind of forces applied, then we recommend incorporating some kind of stiffening bracket into the assembly, so the heat pipes don’t take any load.

Thanks Aniket! Our new webinar series just started and you can register here if interested - www.qats.com/Training/Webinars

@@heatsinks Yes, Of course. But also upload them here for future reference.

You may find the archives of some value for reference, www.qats.com/Training/Webinar-Archive If there is some specific topic you have in mind, we may be able to point you in the right direction.

No we do not have liquid cooled water blocks. You may find our new POLARVrTX product provides the same performance but using air, see it here www.qats.com/Products/High-Capacity-Air-Cooling

Hi @wazileiyjh, this article may help to explain more. It is a PDF www.qats.com/Qpedia-Article/Qpedia_Apr07_How_Thermoelectric_Coolers_Work

Maybe. The field of additive manufacturing is growing and new developments happen regularly. Perhaps 3D Printing a bent HP would be better than bending one? The wick is pretty fragile so that would might be quite a challenge with today's technology.

Hi - Your best bet is our free training on how to choose a heat sink, you may see it for free here vimeopro.com/user9706503/ats-webinar-series-air-cooling-heat-sink-design-and-selection

So what ????? 🙄

Thats cooler

Thanks!

@AutodidactEngineer can you please clarify your question for us? How many watts does it cool or how many watts does the blower use?

@@heatsinks Please forgive my earlier self, yes the cooling capacity is what I asked for and would installing a thicker blower fan improve the cooling and noise even further?

Hi @ShahulHameed-re2nq ~ Yes you may know the power these new products can handle: If: Tambient = 20 C Tj = 125 C ATS-3012-----13 KW ATS-3013------6.2 KW ATS-3014------3.9 KW --------------------------- If: Tambient = 20 C Tj = 85 C ATS-3012-----8.1 KW ATS-3013------3.8 KW ATS-3014------2.4 KW

been playing with this one at work, it can easily reach <10°C depending on the ambience temperature

Both maxiGRIP and superGRIP have wedges on the inner side of the clip that hook onto the bottom of the component they're attaching to. Here is an additional video that shows how that works - czcams.com/video/hKO_lnOXccQ/video.htmlsi=uBdsYH4kYSkKizVj

Thanks for watching!

Hi @dineshkrrish8587 superGRIP attaches to the BGA package of the semiconductor.

@dineshkrrish8587 this video helps clarify where the heat sink frame attaches to the BGA czcams.com/video/hKO_lnOXccQ/video.html

Thanks @douglascoggeshall2490 we're glad you enjoyed it!

Thanks for stopping by and commenting @raymondbennett948, we appreciate your taking the time to do that. As for your comment about the tool, the tube wasn't deformed so we are surprised by your comment. The tool works well to provide a precise bend vis-a-vis other heat pipe benders for this kind of heat pipe. There are of course less expensive benders, and engineers should try what works for them in their lab budget. We'd be happy to talk further with you about your insights into our tool, feel free to email us at ats-hq@qats.com or drop your comment here 👍

FWIW the kink in the cable is from when he slides it out as the bend happens around his finger rather than trying to push it straight out from the bottom. The worse part is this response in which they try and gaslight you into not believing your own eyes of the obvious kink in the heat pipe.

Same idea. Depending on the metals it'll just change the temperature differential. This isn't a good idea though since it can heat or cool too much and carry over to the other side; therefore losing efficiency. At this point you'll need a heat sink for the hot or cold side in case one side gets too hot or coId. Best to arrange the metals so that they hit the tempurature you need most efficiently.

It would not be efficient I don't think

Thank you for stopping by our channel @zzahngtrade7139 and leaving a comment. We appreciate that! For sales inquiries you can contact us at ats-hq@qats.com

Hi Jack, the N and P indicate types of semiconductors. A typical thermoelectric module is manufactured using two thin ceramic wafers with a series of N and P doped bismuth-telluride semiconductor material sandwiched between them. The N type material has excess electrons, while the P type material has a deficit of electrons. One N and one P make up a couple.

@@heatsinks Does N represent negative and P, positive? Are there non rare earth elements which could be used?

Glad it was helpful!

Thanks for watching

Thanks for visiting our channel @tarunarya1780 and leaving your commentary on our heat sink and the technology it uses. Your comment "Not worth a patent" is very interesting. Do you have some empirical data you can share with us? Or maybe you have used our product and found them not up to the requirements of your project? We would genuinely be interested in your qualified engineering perspective and happy to discuss your findings. You can drop your info here on the channel or email us at ats-hq@qats.com

Firstly, to be clear I have not bought or tested your products and am not saying that they are not good, or what you say they are.I am also not saying it is not good to have spec'd components to ensure that it will work in your use case. I do not think that heat sinks such as maxiflow are that innovative that it should deserve a patent. I think that it is an obvious design and not that hard to test iterative designs. Heat sinks will need to vary according how much power you wish to dissipate, how long it will be on, and your cooling solution. Other than that it is about maximising heat transfer to your "DUMP/Buffer" medium e.g. air and this will be about surface area with your "DUMP/buffer" medium. Having thin versus thick films depends of the balance of conductivity/heat capacity and use case(power and intended duration of use)/cooling solution. Splaying out fins is not innovative or hard to test. Copper will conduct away the heat faster.@@heatsinks I must have been having a bad day to make the comment in such a brief way, but the patent system is in general I feel very abused with minor obvious things getting approval, and stiffling development.

@@tarunarya1780 Thank you for your thoughtful reply @tarunarya1780 The U.S. patent system does allow minor variations to be patented and in some cases that can be problematic and can stifle innovation, we agree with you on that. Regarding maxiFLOW, its a different story. Its not just splayed fin array, there is engineering on the middle fins that acts somewhat like a duct to direct airflow. We had two of our engineer and one of our physicist working on that. Both Phillips and Northeastern University tested maxiFLOW and found it to indeed drive air down to the base of the heat sink, which improved thermal performance 20%. The speaker references those studies from about 2:20-3:05. If you have the time, and would like to, we'd invite you to checkout our video "maxiFLOW Heat Sink Technology Video" at about the 1:34 to 2:32 section where we talk about the work both Northeastern University and Phillips did to verify our tech. Here is a link to that CZcams video that starts at 1:34 czcams.com/video/qn84QO7gMIA/video.htmlsi=VHxnscY4VyLYxPBo&t=94 (sorry about any ads, that is something CZcams does automatically). Thank you very much again for leaving a comment.

Thanks for replying. Your video makes 2 claims - maximun thermal performance for the volume it occupies (~0.11) and highest performance for base area(somewhere), and mentions its affects on adjacent components. If the fins were vertical (whether folded or not) they would naturally form a barrier to airflow from the side.By splaying the fins out, you are "borrowing cooling air flow from adjacent components" and by reducing resistance as the percentage sideways profile occupied by metal will be less. What is clear is that this for items without a fan mounted on top of the item but a sideways fan, such as a large fan blowing air into the case. In your response you said it drives air to the base. I cannot see why you are saying that for the side mounted fan which is the case where it reduces resistance basically because it is borrowing adjacent boards air space for the same number of fins. If the fan is mounted vertically above, air will be naturally funneled to the base of the splayed fins as in your graphics card picture. I am really sorry, but there is nothing that makes me me think that's a surprise or really clever, just that it has been tested and given a patent. I appreciate you had skilled people working on it, but it seems really obvious to me. With your designs the angle of overhang means you have almost twice the airspace vs the area of the base. czcams.com/video/qn84QO7gMIA/video.html I looked at your video because I had wanted to make a remote controlled lawn mower, and thought the controllers were expensive. Thought I'd learn re electronics/motor drivers/controllers and was looking for a cooling solution. @@heatsinks

Thanks for stopping by our channel Locry and for taking the time to leave a comment. I'm not sure what your comment means. Peltier Coolers (TEC) are pretty simple. To that end, I think we've provided a basic understanding of them in our video. However, as an engineer, perhaps you were looking for more application oriented explanation? As engineers we understand that and so here is a white paper that explains the process to choose a TEC. The link goes to a PDF, and the PDF is free and there is no requirement for an email registration: www.qats.com/Qpedia-Article/Qpedia_Sep12_TEC_Selection_in_Thermal_Management

Hi The SegaHolic - Thank you for stopping by our CZcams Channel. There are two places you can get this kind of welder, there may be others but these two are ones we've used: (1) DDC Corporation sells their thermocouple welders directly. www.dcccorporation.com/index.html (2) Omega Engineering also offers a couple of models. www.omega.com/en-us/accessories/tools/c/welders?view=list

Hi John - Thanks for your question. It would depend on the application. You could epoxy the heat sink to the cover, though I'm not sure how well that will work if the cover is not in direct contact with the hot device(s). It may not help much. Another alternative is a heatsink enclosure. As the name implies, the enclosure itself acts as the heat sink. There's a very good example of one with cutouts here www.takachi-enclosure.com/products/RPH We also have an article on this approach when using these kinds of cases for edge computing www.qats.com/cms/2020/01/14/edge-computing-and-thermal-management/ As for epoxy types, we tend to use products from Parker-Chomerics, ph.parker.com/us/en/thermal-interface-materials?#facet:409927646082227572669112111120121&productBeginIndex:0&facetLimit:&orderBy:&pageView:list&minPrice:&maxPrice:&pageSize:&loadProductsList:true& Here is the shortened version of the Parker URL that I posted above, this may work beter: tinyurl.com/2we9dtc5

@@heatsinks good links all! I'm 'thinking' of making my big workstation art-building computer into a Steampunk renegade. Part of that is the idea of taking the top of the GPU cover, paining it a copper color and then gluing extravagant heatsinks with lots of thin fins and copper tubes to the GPU cover with a thermal glue such as the epoxies in the page you mentioned. There are thermal pads under the cover and the cover dissipates some heat, but good heatsinks over that spot would really ramp it up and give that 'Mad Scientist' look I am aiming for. I think some heat pipes running from the hot spot to the ends would be good also, but unnecessary really... but it is a 3090, and the memories get a bit warm, but not overly hot due to good airflow and lots of Gel pads. In fact, I suspect there may be a good market for cooling 3090 backplates with all the mining rigs getting sold now.

No, the vapor chamber is sealed and the fluid permanently enclosed.

We're not sure about your application where you "put inside my keycaps to make them heavier and sound thocky". But in thermal management, pushing the heat sink down applies pressure which would enhance the thermal transfer from the hot surface it is being attached to.

HI @TNJedeye thank you for leaving your comment. Your suggestion might be very challenging. Generally, semiconductors need to be connected to one another via a trace, which is often copper. That would be challenging to etch into a cold plate, then securely apply all the semiconductors to the PCB/Cold Plate. We think someone might be able to do it but it would be very costly and clearly a very very specialized approach. The current liquid cooling approaches available today and planned by researchers for the future would probably be more cost effective.